下模固定，上模以等速度並向下模進行壓合、持壓、拉伸進行模擬，其鍵結界面

下模固定，上模以等速度並向下模進行壓合、持壓、拉伸進行模擬，其鍵結界面是合金的上、下模塊壓合時產生結合薄膜

Kết quả (Anh) 1:

Lower fixed mold does die down at such speed the progress of line pressure, pressure, stretch the progress line mode 擬, 鍵 used interface is alloy upper and lower die 塊 pressure-in-time produce results-film

Kết quả (Anh) 2:

Fixed lower mold, the upper mold at equal speed to the lower mold lamination, holding pressure, stretching simulate its bonding interface is on the alloy under pressure modules combine to produce timely film

Kết quả (Anh) 3:

Under the fixed mode, the mode with a constant velocity and down mode by pressing and holding pressure, tension was simulated, the bonding interface is alloy of upper and lower modules when pressing on a film